Esko’s Packaging & Label Forum returns to UK

Packaging & Label Forum, organized by Esko and its partners, has been confirmed to return to the UK in November 2024, for a second two-day event to discuss the future of the label and packaging supply chain.

Esko is again staging the event in association with some of its partners, including Bobst, HP, Asahi, Cerm, Flint Group, Maxcess, Tharstern and The Grey Elephant, giving packaging professionals the opportunity to network with suppliers from across the industry, take part in deep dive discussions and hear from industry leaders and keynote speakers.

‘Following the success of last year’s inaugural event, this year’s Packaging & Label Forum will give attendees the opportunity to learn what they might have missed at drupa 2024, as well as taking a detailed look at other specific areas that are key to their business success,’ said Jan De Roeck, director of marketing, industry relations and strategy at Esko. ‘We’re also bring our special Innovation Lab to the UK, giving attendees the chance to preview prototypes that are at advanced stages of development – including a new AI-assisted decision-making tool for upstream packaging project specifications.’

‘We’ll take an in-depth look at the challenges and opportunities facing the industry, everything from how automation is helping increase productivity to the latest solutions helping converters achieve their sustainability goals,’ added De Roeck. ‘Our packed program of sessions will also include speakers from education institutions discussing the future generations of workers in our sector, and industry experts discussing the potential benefits - and those already being enjoyed - through use of Artificial Intelligence in packaging production.

‘Across the two days, experts from across the sector will deliver presentations and lead discussions on not only the latest innovations premiered at this year’s global industry expo, but also on the topics that are top of the agenda for businesses as we look towards 2025 and beyond. With the backing of several of our international partners, we’ve compiled a comprehensive agenda filled with informative and inspiring sessions that will tackle the current challenges in the industry, while also focusing on the future.’

The Packaging & Label Forum from Esko and partners will be held at Holywell Park, Loughborough, UK from November 6-7, 2024. For the full agenda and to register for the free event visit Esko’s website.