Evonik launches Tego Wet 288

New technology for substrate wetting of waterborne and radiation-curing formulations.

Evonik Coating Additives has developed Tego Wet 288, a unique substrate wetting additive designed to address the challenges of waterborne and radiation-cured formulations.

Traditional silicone-based wetting additives often lose effectiveness in high pH aqueous formulations during long-term storage or negatively impact reprintability and glueability in radiation-cured formulations. Tego Wet 288 overcomes these limitations.

‘We developed this innovative technology through close collaboration with our customers,’ said Kai Yang, project manager and head of applied research and technologies in Americas Inks at Evonik Coating Additives. ‘Our Tego Wet 288 shows a performance profile that was previously thought to be unattainable.’

In waterborne inkjet inks, Tego Wet 288 significantly reduces surface tension and maintains its effectiveness over extended periods, outperforming competing technologies. In radiation-cured inks and varnishes, it delivers strong surface tension reduction and wetting while preserving printability and glue ability.

Besides its performance, Tego Wet 288 also provides excellent food contact compliances, which allow for the use of this hydrophobic surfactant in food packaging applications.

Furthermore, Tego Wet 288 provides broad food contact compliance, making it suitable for food packaging applications. This hydrophobic surfactant expands the possibilities for formulators.

‘Tego Wet 288 is the perfect addition to our comprehensive portfolio of solvent-free, high-performance additives for waterborne and UV-cured inks and varnishes, all of which feature broad food contact compliance,’ said Susanne Struck, global head of market segment Inks at Evonik Coating Additives.