AWA gears up for Global Release Liner Summit 2025
Labels & Labeling readers can benefit from the exclusive 15 percent discount.
Alexander Watson Associates (AWA), a global provider of market research and consulting services, has released details of the 25th Anniversary of the AWA Global Release Liner Summit 2025, a landmark event for the release liner industry.
The summit will take place in Chicago from March 19 to March 21, 2025. This year’s edition celebrates a quarter-century fostering innovation, collaboration and progress across the sector.
The summit, themed 25 Years of Bringing the Release Liner Industry Together, will provide a platform to address key challenges and opportunities faced by the entire release liner value chain.
This event focuses on delivering actionable value to the release liner industry, with the Executive Leadership Panel providing strategic insights from industry leaders who drive innovation and transformation.
The program also includes the Voice of the Customer sessions featuring insights directly from producers and users.
Attendees will also be able to join Collaborative Value Chain Discussions, engaging dialogues designed to explore new opportunities and promote sustainable growth.
The summit aims to prioritize users’ voices and needs and drive practical solutions and sustainable advancements that enhance operational efficiency and product performance.
With a spotlight on innovation and sustainable practices, the summit will address the evolving requirements of end-users, such as reducing environmental impact across the value chain, enhancing product performance to meet diverse application needs and adapting to new technologies and regulatory landscapes.
Participants will gain insights into market dynamics and trends, ensuring they stay competitive in a rapidly changing industry.
The conference will take place at the University Club of Chicago. Registration can be completed online. Labels & Labeling readers can benefit from a 15 percent discount by entering the LL25 code at checkout.
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