Tilia Labs named Company to Watch
Tilia Labs, a developer of planning, imposition, and Artificially Intelligent (AI) software, has been named the Company to Watch at the 2021 Digital Packaging Summit.
The event, presented by NAPCO Media Group and the Printing United Alliance, offers printing and converting companies an opportunity to evaluate the impact of digital production printing technology, software, and other technologies for business improvement. The Company to Watch award, recognizing the event’s most exciting new technology, was presented to Tilia Labs for its Phoenix planning and imposition application.
A panel of delegates selected the program over a field that included more than 40 companies representing the industry’s largest brands, including Canon, Ricoh, and HP. Including the Inkjet Summit and Wide-format Summit held earlier this year, this marks the third consecutive event where Tilia Labs has received the award.
‘Congratulations to Tilia Labs for winning the coveted Company to Watch award,’ said David Pesko, event director. ‘It did an excellent job explaining the benefits of its solution throughout the summit. But rather than me telling you why Tilia Labs was selected, this is what one attendee said to me: Its software is solving a problem we know we had but didn’t know how to articulate. Its planning software has made it obvious where our opportunities are for gaining greater efficiencies.’
‘NAPCO digital summits provide a unique opportunity for exchanging information and showcasing and evaluating leading solutions. We find these events extremely valuable for connecting attendees with the sponsors and look forward to being a part of the Inkjet Summit in April,’ said Tilia Labs’ director of sales, George Folickman. ‘While we’re naturally thrilled by this award, the real value is that it serves to further validate our groundbreaking AI technology. Innovation for the sake of innovating is of little value. Technology must be practical, solve real-world problems, and deliver measurable results. We’re honored to receive such ongoing recognition and equally excited by the challenge to solidify further our leadership position as we continue to pursue next-generation solutions.’
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