Announcing The Dieline Forum at Labelexpo Europe 2023

The Dieline will host an exclusive forum at the highly anticipated Labelexpo Europe event in Brussels this fall on September 11- 12. Labelexpo Europe, renowned as the world's largest label and package printing event, is the perfect stage for The Dieline to bring together top industry experts, thought leaders, and visionaries to explore the latest trends, challenges, and sustainable advancements in packaging design.

At this groundbreaking forum, participants will have the unique opportunity to engage in insightful discussions, gain invaluable knowledge, and develop meaningful connections with fellow designers and industry professionals. The forum will feature captivating keynote speeches from Jemma Wong of PlasticFree.com, Andreu Gadea of Lavernia & Cienfuegos, Jonas Andersson of Brand Union Stockholm, Jo Tulej of Mother Design, Matt Lurcock from Turner Duckworth, and more soon to be announced, all aimed at sparking creativity and pushing the boundaries of packaging design.

With The Dieline's unwavering commitment to driving innovation, the forum promises to be a pivotal moment for the packaging design community. Attendees can expect to be inspired by thought-provoking presentations, discover cutting-edge techniques, and explore emerging sustainable trends that are shaping the future of packaging.