GIP debuts Label Modular HD hybrid press at Labelexpo South China

Chinese digital press supplier GIP (General Inkjet Printing Technology) has confirmed that it will showcase its latest Label Modular series at the coming Labelexpo South China 2024 in Shenzhen, China.  

It is a modular digital-flexo hybrid printing press for the label industry, integrating the advantages of digital inkjet technology and traditional flexo printing technology. 

Label Modular series combines the rich R&D experience of digital inkjet printing of GIP and the flexo printing technical precipitation of Spande, which is a professional flexo press supplier. It has been comprehensively upgraded in terms of exterior design, printing performance and flexible configuration, to provide customers with high-quality and intelligent label production solutions. 

The Label Modular HD adopts Kyocera print heads, 1200x1200 DPI and can achieve 8-color printing, including CMYK+W and three spot colors. Its max printing width reaches 520mm, and the running speed is up to 150m a min. 

The Label Modular series adopts a highly modular unit design and can be flexibly configured other units according to the actual production needs of customers, such as flexo printing units, coating, cold/hot stamping, die-cutting and laminating. 

Each unit is equipped with rail guide systems, which makes it convenient to add turnover frames, peeling/laminating and laminating units.  

According to GIP, Label Modular series will be a perfect solution for not only small-run label orders, but also for mid- and large-run production, achieving a win-win situation in terms of production efficiency and quality. 

Xuebin Huang, CEO of GIP, said: ‘This is our another innovative after drupa for the 1200x1200 DPI digital press. In September this year, we participated in Labelexpo Americas 2024 in Chicago, USA, and the feedback is beyond our expectations. For the coming Labelexpo South China 2024 in Shenzhen, we are looking forward to debuting our latest product for global converters. You are welcome to talk with us at booth B1 and D3.’