Labelexpo Americas 2024 officially opens
Over 400 exhibitors and a comprehensive educational program await attendees of the only labels and packaging-focused trade show in the Americas.
Donald E. Stephens Convention Center in Rosemont, Illinois, has officially opened its doors for this edition of Labelexpo Americas 2024, featuring over 400 international exhibitors. This year it focuses its educational program on RFID technology, flexible packaging and automation.
This year the show presents more technologies and live demonstrations than ever, including new, wider flexo presses, conventional and hybrid technology as well as a wide range of digital label and package printing equipment.
To help converters understand all aspects of the flexpack workflow, Labelexpo Americas 2024 has introduced a dedicated ‘exhibition within an exhibition’ called FlexPack@Labelexpo. It allows show visitors to focus on materials, lamination technology and pouch manufacturing machinery, supported by a half day deep dive flexible packaging masterclass organized by the Label Academy.
FlexPack@Labelexpo is located in Hall F of the Donald E Stephens Convention Center. Exhibitors will be present to talk about everything from materials - films, zippers, thermal laminates, overprint varnishes for example - to curing technology, laminating technology, slitting machinery, pouch-making and spouting equipment.
Companies currently confirmed in the FlexPack@Labelexpo zone include Karlville, Gonderflex, S-One LP, ABG, Mamata, Protect-All, Novaflex, Bonset American Corporation, Sanzip re-closable zipper and Nobelus. In addition, three times a day, visitors will have the chance to attend a short introduction to flexible packaging presented by HP.
Also featured is an RFID experience (radio frequency identification). Attendees have the opportunity to learn more about the growth of RFID, see live demonstrations of how smart labels are produced, and understand how data is stored, tracked and managed.
The RFID in labels and package printing workshop, which will also take place on September 12, aims to provide the necessary technical knowledge for label and other converters looking to enter the arena of RFID and smart labeling.
Exhibitors also present new technologies in a 20-minute presentation at the Innovation Stage.
TLMI, the sponsoring partner for Labelexpo Americas 2024, hosts an Eco Stage on the first two days of the show, presenting the latest developments in sustainability. The Eco Stage is designed to support a better performing, more environmentally conscious label and package printing industry. Sessions include topics such as tackling the big myths surrounding sustainable packaging, what converters should be concerned about and the key takeaway actions.
Also taking place is a converter leadership lunch on September 10, featuring a wide-ranging panel discussion including Elizabeth Yerecic, executive vice president of sales and sustainability and co-owner of Yerecic Label; Bruce Hanson, CEO of AWT Labels & Packaging; Guido Iannone, chief sales officer and president for Mexico, South Africa and China at All4Labels and Craig Curran, president of Nosco. They will address key industry trends, including sustainability, automation and workforce development.
A breakfast networking session will take place on September 11. The keynote speaker, Katie King, CEO of AI in Business, will discuss how AI and automation are transforming the label and packaging industry.
On the first evening of Labelexpo Americas 2024, the Opening Night Party will feature the Label Industry Global Awards recognizing key achievements and celebrating excellence in the label and package printing sector.
Tasha Ventimiglia, group director at Labelexpo Americas, said: ‘Flexible Packaging, sustainability, RFID, AI and automation are all key topics that are trending in the label and package printing industry right now, so it made sense to capitalize on these trends at this year’s Labelexpo Americas. FlexPack @ Labelexpo, for instance, will allow attendees to see short-run, added-value flexible packaging, including all the ancillary equipment, thermal lamination, pouching equipment, materials, and coatings required to enter this demanding market. We look forward to showcasing these fast-growing areas of the industry to all attendees.’
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