Esko Packaging & Label Forum gathers nearly 100 professionals

Esko Packaging & Label Forum, a two-day event organized in the UK, has gathered nearly 100 packaging professionals from across the industry, who heard from leading sector experts and discussed the future success of the global packaging industry.

Packaging converters, suppliers and technology developers converged at Loughborough University’s Science and Enterprise Park to engage in detailed analysis, discussion sessions and training while hearing from a broad range of industry leaders and speakers.

‘The world around us is continually changing,’ said Jan De Roeck, Esko director of marketing, industry relations and strategy. ‘In order to make our businesses thrive, we need to continually adapt – and that means looking to the future.’

Across two days, more than 25 different sessions addressed everything from current market dynamics and new technological innovations to hugely detailed examinations of color management in the context of sustainability and how new job onboarding is streamlining upstream processes.

Sessions also included speakers from educational institutions who discussed the importance of attracting and training future generations of workers and the latest developments in AI in the context of packaging production.

‘We expanded the content program for this Packaging & Label Forum, the second to be held in the UK, and it was heartening to have provided this platform for so many customers, partners and suppliers to congregate and share their experiences, concerns and opinions on the issues that are driving our industry,’ said De Roeck. ‘With more breakout sessions, presentations and detailed discussion groups than before, we ensured the event gave attendees the opportunity to closely examine and identify the specific areas that are vital to their own business success.’

The event also allowed attendees to experience Esko’s Innovation Lab, where its experts preview prototypes at advanced stages of development, including a new AI-assisted decision-making tool for upstream packaging project specifications.

‘The event was a huge success in terms of spotlighting some of the amazing innovations that are already helping accelerate go-to-market for packaged goods and how converter businesses are continuing their digital transformation journey in order to meet the ever-changing demands of today,’ said De Roeck. ‘What’s more, the forum gave attendees a platform where they could discuss new strategies for growth, discover tools to drive productivity and even meet potential new partners for exciting collaborations.

‘As the global packaging supply chain continues to face challenges, it is crucial that experts and professionals from across the industry come together at events like this to help shape the future of label and packaging production.’

Esko organized the 2024 Packaging and Label Forum in association with partners such as Asahi Kasei, Bobst, Cerm, Flint Group, HP, Maxcess, Tharstern and The Grey Elephant.