New products from Emerson & Cuming

Low temperature cure, thermally conductive film adhesive

Emerson & Cuming introduces the latest innovation in adhesive technology, Ablefilm 566K. This product is a high strength, electrically insulating and thermally conductive adhesive film. 566K is ideally suited for thermal transfer assemblies such as bonding heat sinks to printed circuit boards, attaching lids or sealing hermetic packages. The low flow characteristics allow it to avoid contamination of adjacent components in precision assemblies. 566K can be cured as low as 90oC. This material has a volume resistivity of 1.4x1013 ohm-cm making it a great insulator between electrically active parts.  The 566K eliminates voids and thermal discontinuities with its uniform bond line. The bond line thickness can set by the film which can be made as thin as 4 mils. The adhesive film can surpass the thermal and mechanical performance of pressure sensitive tapes.  It can conduct heat at the rate of 0.8 W/m K. The 566K can be die or laser cut to create performs specific to your application needs. 

Thermally conductive adhesive for bonding high power LED’s

E3503-1 is a new one component, high performance adhesive that provides excellent thermal conductivity and strength which is critical for bonding high power LED’s. The product features a thermal conductivity of 1 W/m.K that allows efficient heat transfer from the high power LED's to PCB's or for other heat sensitive devices. The adhesive can be cured as low as 100C for 20 minutes or at 150C for 1-2 minutes. This one component adhesive is designed for high volume assemblies and is packaged in syringes.

High temperature electrically conductive adhesive

Emerson & Cuming introduces the latest solution in electrically conductive pastes, CE-8500. This product is a one component, high temperature, low stress conductive adhesive. It is a modified epoxy combining the strength of epoxy and the flexibility of a silicone. CE-8500 is ideally suited for mismatched TCE applications such as substrate attach and heat sink bonding.  It has outstanding high temperature characteristics, being useful up to 200oC. The CE-8500 is designed for syringe dispensing applications. It can be cured as low as 110oC in 2 hours and has a volume resistivity of 5.0 x10-4 ohm-cm. In addition, the material has a work life of 8 hours at 25oC.  This adhesive can conduct heat at the rate of 4 W/m K. The CE-8500 combines low stress with good adhesion on nearly all surfaces.